ACM Solid and Physical Modeling Symposium 2008
[email protected]

Stony Brook University, Stony Brook, New York, USA
June 2-4, 2008

ACM Solid and Physical Modeling Symposium 2008 (SPM’08) will be held
on June 2-4, 2008, in Stony Brook University, Stony Brook, New York,

This highly successful conference series have been a primary venue for
disseminating research results and exchanging new ideas in geometric
and solid modeling, physical modeling, geometric design, analysis,
simulation and processing, shape computing and visualization, and
various applications. SPM’08 will be immediately followed by the
International Conference on Shape Modeling and Applications 2008
(SMI’08), to be held in Stony Brook University, Stony Brook, New York,
USA, on June 4-6, 2008. Both SPM’08 and SMI’08 events will be
co-located in Stony Brook University, and are parts of the 2008 Stony
Brook Modeling Week that features International Joint Convention on
Shapes and Solids (ICSS’08).

Selected papers of outstanding quality accepted at SPM08 will be
published in: IEEE Transactions on Visualization and Computer
Graphics, IEEE Transactions on Automation Science and Engineering,
Computer Aided Design, and Computer Aided Geometric Design. SPM08 Best
Paper Award is sponsored by Siemens UGS.


November 27, 2007: Abstracts due
December 4, 2007: Full papers due
January 31, 2008: Acceptance decisions
March 1, 2008: Camera-ready papers due
June 2-4, 2008: SPM’08

The paper submission site is now OPEN:

Program Chairs:
Dinesh Manocha (UNC, USA)
Bruno Levy (INRIA, France)
Hiromasa Suzuki (University of Tokyo, Japan)

Conference Chairs:
Hong Qin (Stony Brook University, USA)
William Regli (Drexel University, USA)

For more information about SPM08, please visit

Please direct any inquiries to [email protected], or [email protected]

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